| Current Technology Capability and Future Development |
|
|
|
| Process Capability |
| Feature ( all dim. in mm ) |
Current Process Capability |
Future Development |
| Standard |
Advanced* |
 Max. Layer Count |
2-8 |
10-16 |
18-24 |
| Max. Aspect Ratio (PTH) |
8:1 |
10:1 |
12:1++ |
| Min. Drill Size (PTH) |
0.3 |
0.25 |
0.2 |
| Min. Board Thickness |
0.5 |
0.4 |
0.3 |
| Max. Board Thickness |
1.6-2.0 |
2.4-3.8 |
4.0-5.0 |
| Min. Core Thickness |
0.1 |
0.075 |
0.05 |
| Min. Prepreg Thickness |
0.075 |
0.05 |
- |
| Min. Copper Foil Thickness |
0.5 oz |
0.33 oz |
0.25 oz |
| Max. Copper Foil Thickness |
2 oz |
4 oz |
5-12 oz |
| Min. Innerlayer Line / Space |
0.125/0.125 |
0.10/0.10 |
0.075/0.075 |
| Min. Outerlayer Line & Space |
0.125/0.125 |
0.075/0.10 |
0.075/0.075 |
| Min. Pad dia. for tangency (Drill + x) |
0.25 |
0.2 |
0.15 |
| Press Fit Hole Size Tol. (+/-) |
0.075 |
0.05 |
0.04 |
| Drill Registration Tol. ( +/-) |
0.075 |
0.05 |
- |
| Image Registration Tol. (+/-) |
0.075 |
0.05 |
0.0375 |
| Soldermask Registration Tol. (+/-) |
0.075 |
0.05 |
0.025 |
| Rout / Scoring Tol. (+/-) |
0.125 |
0.1 |
0.075 |
| Impedance Single Ended Tol. (+/-) |
10% |
7% |
5% |
| Impedance Differential Tol. (+/-) |
10% |
7% |
5% |
| Warp and Twist |
1% |
0.70% |
0.50% |
|
|
| Heigh Density Interconnect (HDI) |
| Feature ( all dim. in mm ) |
Current Process Capability |
Future Development |
| Standard |
Advanced* |
| Mechanical drill Blind Via hole size |
0.3 |
0.25 |
0.15 |
| HDI Dielectric material |
Laser Drill FR-4 |
Laser Drill FR-4 |
RCC |
| Laser Blind Via hole size |
0.15-0.20 |
0.125-0.25 |
0.10-0.30 |
| Min. Target / Capture Pad diameter |
0.3 |
0.25 |
0.2 |
| Max. Laser Blind Via Depth |
0.075 |
0.125 |
0.15 |
| Max. Laser blind via Aspect Ratio |
0.7 |
1 |
1.2 |
| Sequential Lamination |
- |
Yes |
Yes |
| HDI Type Construction |
Type I |
Type I, II, III |
Yes |
| Build Up Layers |
- |
2-N-2, Staggered |
3-N-3, Stacked |
| Copper Fill Plating for Stacked Vias |
- |
No |
Yes |
|
|
| Materials |
| Feature |
Current Process Capability |
Future Development |
| Standard |
Advanced* |
| FR-4 |
Tg 135, 145,170 'C |
Tg 180 'C |
Tg 200 'C |
| Halogen Free |
No |
Laminate / Soldermark |
- |
| CAF Resistant Laminate |
No |
Yes |
- |
| FR-4 High Thermal Resistance |
No |
Yes |
- |
| Getek |
No |
Yes |
- |
| Rogers 4003 / 4350 / 4450 |
No |
Yes |
Dk < 3.5 |
| Nelco N4000-13 |
No |
Yes |
CTE-z < 40ppm/'C |
| Soldermask |
Taiyo PSR-4000 |
Probimer 77 |
Mask web spacing |
| Via Filler Peters SD 2361 |
Yes |
Yes |
Conductive Filler |
| Peelable mask Peters SD 2954 |
Yes |
Yes |
- |
| Carbon Ink ( Tamura , Electra ) |
Yes |
Yes |
- |
| Hard Gold (edge connectors) |
Yes |
Yes |
- |
| OSP |
Entek Plus |
Glicoat |
Entek Cu106HT |
| HASL |
Yes |
Yes |
Lead Free HAL |
| Immersion Gold |
Yes |
Yes |
- |
| Immersion Tin ( Stannatech ) |
Yes |
Yes |
- |
| Immersion Silver ( Sterling ) |
Yes |
Yes |
- |
|
|
| Special Process Offerings |
| Feature |
Current Process Capability |
Future Development |
| Standard |
Advanced* |
| Thermal Heat Sink Attach |
No |
Yes - low flow prepreg |
adhesive |
| Via In Pad Technology |
No |
Yes |
conductive link |
| Thermal Conductive Ink |
No |
Yes |
- |
| Embedded Capacitance |
No |
No |
evaluation |
| Buried Resistors |
No |
No |
evaluation |
| Punch Fabrication |
Yes |
Yes |
- |
|
|
| *NOTE : |
| 1.) |
Advanced Process Capability requires additional process steps and/or special materials / processing. |
| 2.) |
Advanced Process Capability will have limitied production output and cost adders. |
| 3.) |
Orders deemed to fall under the advanced capability will be managed by the NPI Engineering Team |
|
